· Low dielectric constant below 4.7, reduces signal delay, excellent high-frequency performance, and can reduce signal loss by 30% in 5G millimeter wave communication

· Outstanding thermal mechanical stability effectively avoids high-temperature packaging warpage issues. On ultra-thin substrates, TGV technology can still control warpage to a very small range, ensuring long-term reliability of chip stacking

· In the "post Moore's era" where the physical limit is below 3NM, heat generation is severe, and power consumption increases dramatically, glass substrate packaging density is 10-100 times that of silicon-based materials, making it an ideal material for 3D chip packaging

· Its cost is 1/8 of silicon-based materials, and there is no need to deposit insulation layers, reducing the process flow by more than 30%.